+86-0755-29492199
服務(wù)郵箱:kelisonic@163.com
24H技術(shù)支持:18588468367
地址:深圳寶安松崗東方社區(qū)南邊頭工業(yè)C區(qū)2棟1樓
超聲波發(fā)生器產(chǎn)品特點(diǎn)
Ultrasonic Generators Product Characteristics
單片機(jī)控制,IGBT工作模式,超聲波輸出功率較舊式電路增加15%以上,且連續(xù)無(wú)級(jí)可調(diào),液晶顯示。
超聲波發(fā)生器裝置工作電壓220 V Ac±10%,超聲波發(fā)生器具有過(guò)壓,過(guò)流,輸出短路等保護(hù)措施。
超聲波發(fā)生器具有功率無(wú)級(jí)調(diào)節(jié)的功能,輸出功率可實(shí)現(xiàn)10~100%的連續(xù)調(diào)整,以適應(yīng)各種清洗對(duì)象的要求。
超聲波發(fā)生器配備有數(shù)字式超聲波工作時(shí)間0~999min 設(shè)定,精確到秒,實(shí)現(xiàn)無(wú)人自動(dòng)值守。
Singlechip-control, IGBT operating mode, the ultrasonic output power is greater than that of the old style circuit by over 15%, and it works in a continuous way without adjustable steps, liquid-crystal display
The ultrasonic generator operating voltage 220 V AC±10%,and ultrasonic generator has various protective measures against the potential dangers of overvoltage, overcurrent and output short-circuit.
The ultrasonic generator has the function of stepless adjustment for its power, and its output power can realize 10~100% continuous adjustment, in order to better suit various objects to be cleaned.
The ultrasonic generator is equipped with digital display of ultrasonic work time 0~999min settings, correct to seconds, and it can control and regulate automatically , needless for care by people.
工業(yè)清洗類的超聲波發(fā)生器的原理是由超聲波發(fā)生器發(fā)出的高頻振蕩信號(hào),通過(guò)超聲波振子轉(zhuǎn)換成高頻機(jī)械振蕩而傳播到介質(zhì)清洗溶劑中。超聲波發(fā)生器在清洗液中疏密相間的向前輻射,使液體流動(dòng)而產(chǎn)生數(shù)以萬(wàn)計(jì)的微小氣泡,存在于液體中的微小氣泡(空化核)在聲場(chǎng)的作用下振動(dòng),當(dāng)聲壓達(dá)到一定值時(shí),氣泡迅速增長(zhǎng),然后突然閉合,在氣泡閉合時(shí)產(chǎn)生沖擊波,在其周圍產(chǎn)生上千個(gè)大氣壓力,破壞不溶性污物而使它們分散于清洗液中,當(dāng)團(tuán)體粒子被油污裹著而粘附在清洗件表面時(shí),油被乳化,固體粒子即脫離,從而達(dá)到清洗的目的。半導(dǎo)體超聲波發(fā)生器的應(yīng)用范圍:
半導(dǎo)體專用單槽式超聲波清洗機(jī),采用全橋式數(shù)字超聲波發(fā)生器,LED數(shù)顯式時(shí)間溫度控制系統(tǒng),核心功率件采用進(jìn)口,性能更穩(wěn)定,壽命長(zhǎng),先進(jìn)自動(dòng)寬頻掃描技術(shù),選擇不同的波段寬度和掃描頻率,提升換能器工件性能,消除駐波,改善超聲波能量分布,與普通超聲波相比效率更高、性能更穩(wěn)定
KP系列超聲波振板用于擴(kuò)散后的硅片拋光刻蝕、清洗處理,以及搭配雙面電池背面制絨、清洗處理。
Ultrasonic CleanerThis equipment is used for polishing, etching and cleaning treatment of diffused wafers and also compatible for texturing and cleaning treatment of bifacial solar cells.